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Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

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SAN JOSE, Calif., July 15, 2026--Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation and tightly int

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Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging | Steek AI Signal | Steek